Low Temperature Co-fired Ceramic
Diskripsen
Teknikel Paramita
Low Temperature Co-Fired Ceramic Technology em i wok bilong wokim ol hul long masin, pulapim ol wantaim 'conductor paste', prinim, putim long paket, na ol narapela wok we ol i save yusim long kamapim ol samting bilong elektronik long ol 'raw ceramic strips'. Olsem wanpela nupela teknoloji, LTCC i gat bikpela aplikesen maket na bikpela sans bilong divelopmen long bihain taim. Ol i save yusim dispela long kain kain wok, olsem kompyuta saiens, otomotiv indastri, medikel sekta na aerospace.
Risets Daireksen
Divelopmen daireksen bilong LTCC em long kamapim ol nupela kain seramik tep sistem wantaim liklik kos, gutpela pefomens na stretpela wok. Ol dispela seramik tep sistem i mekim na ol i ken wokim ol ilektronik divais wantaim bikpela na liklik-frikwensi miksing, ol kompleks hul, bikpela-densiti integresen, na liklik.
Teknoloji Proses
Punching → Filling → Printing → Stacking → Pressing → Hot Cutting → Co-Fired → Scribing→ Testing
Introdaksen bilong prodak
1,Ol samting bilong traim: Lukluk
Ol tul bilong testim: Stereomikroskop
Ol Rot bilong Testim: GJB548B Rot 2032
Teknikel Indeks: 80% bilong ol grafik hap i pinis
2,Test Items:Overall Dimension
Ol tul bilong testim: Vernier Caliper, tul bilong skelim piksa
Ol rot bilong testim :GJB548B, Rot 2016
Teknikel Indeks:
| Samting | Mistek |
| Dimensen | ±0.2 mm |
| Warpage | Stap antap long 3% |
| Cavity | ±0.1 mm |
3,Test Items: Membrane Adhesion
Ol Tul bilong Testim:3M610 Adhesive Tep
Ol Rot Bilong Testim: ASTM B571-97 Rot Bilong Testim Tep
Teknikel Indeks : Aninit long wanpela 40X maikroskop, i no gat wanpela samting i kamap long 'membrane layer' long wanem kain rot
4,Test Items:Hai Tempereture Resistance bilong Membrane Layer
Ol Tul bilong Testim: Hot Stej
Rot bilong testim: Holim long 400 digri inap 10-pela minit
Teknikel Indeks: Aninit long wanpela 40X maikroskop, i no gat wanpela samting i senis kala, skin i lus, ol sua, o skin i bruk long membrane leia long wanem kain rot
5,Ol narapela Teknikel Indeks
| Samting | Teknikel Indeks |
|
Diamita bilong hul |
0.2 mm,0.15 mm |
|
Stretpela ples bilong paitim |
±10 µm |
| Stretpela pasin bilong bungim ol samting | ±10 µm |
|
Printim bikpela lain we i liklik tru |
75 µm |
|
Stretpela Tiknes bilong Piksa |
±2 µm |
| Strong bilong Pasin |
＞3 g(25 μm Diamita Gol tred) |
| Film Adhesion | ＞0.5 kg/mm2 |
| Namba bilong ol leia | 5~30 leia |
Senta bilong 'Microcircuit'
Microcircuit Center i bin kamap long 2022, wantaim ol indipenden risets na wok bung wantaim ol narapela kantri. Ol saveman bilong indastri i save go pas long tim long lukautim ol wok bilong teknikel risets na divelopmen. Dipatmen i gat wanpela 'purification plant' we i gat 1500 skwea mita na wanpela 'technology research' na 'development' tim we i gat moa long 10-pela manmeri, wantaim ol 'industry-liding teknikel kapabiliti. Ol i wokim 'microcircuit center' wantaim LTCC (Low Temperature Co fired Ceramic) Ceramic prodaksen lain, 'punching', 'printing', 'laminating', 'laminating', 'co firing', 'cutting' na ol narapela wok i go wantaim. Long wankain taim, i gat tu wanpela 'thin film' prodaksen lain wantaim ol gutpela wok olsem 'sputtering', 'photolithography', na 'electroplating', we i ken mekim ol 'conventional thin film circuit' prodak na DPC prodak.
Hot Tag: low temperature co-fired ceramic, China low temperature co-fired ceramic manufacturers, suppliers, factory
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